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  attention: observe precautions for handling electrostatic sensitive devices. esd machine model = 50 v esd human body model = 1000 v refer to avago application note a004r: electrostatic discharge, damage and control. description avago technologies mga-30989 is a broadband, high linearity gain block mmic amplifer achieved through the use of avago technologies proprietary 0.25um gaas enhancement-mode phemt process. the device required simple dc biasing components to achieve wide bandwidth performance. the temperature compensated internal bias circuit provides stable current over temperature and process threshold voltage variation. the mga-30989 is housed inside a low cost rohs compliant sot89 industry standard smt package (4.5 x 4.1 x 1.5 mm). component image notes: package marking provides orientation and identifcation 9g = device code x = month of manufacture features ? high linearity ? built in temperature compensated internal bias circuitry ? no rf matching components required ? gaas e-phemt technology [1] ? standard sot89 package ? single, fixed 5v supply ? excellent uniformity in product specifcations ? msl-1 and lead-free halogen free ? high mttf for base station application specifcations 3.5ghz, 5v, 51ma (typical) ? 12 db gain ? 36.8 dbm output ip3 ? 2 db noise figure ? 23.6 dbm output power at 1db gain compression 5ghz, 5v, 51ma (typical) ? 9.6 db gain ? 38.4 dbm output ip3 ? 1.65 db noise figure ? 23.8 dbm output power at 1db gain compression applications ? if amplifer, rf driver amplifer ? general purpose gain block note: 1. enhancement mode technology employs positive gate voltage, thereby eliminating the need of negative gate voltage associated with conventional depletion mode devices. 9gx top view rfin gnd rfout #1 #2 #3 bottom view rfout gnd rfin #3 #2 #1 mga-30989 2 - 6ghz, high linearity gain block data sheet
2 absolute maximum rating [1] t a =25 c symbol parameter units absolute max. v dd,max device voltage, rf output to ground v 5.5 p in,max cw rf input power dbm 24 p diss total power dissipation [3] w 0.47 t j,max junction temperature c 150 t stg storage temperature c -65 to 150 thermal resistance thermal resistance [2] jc = 81.2c/w (vdd = 5 v, ids = 48 ma, tc = 85c) notes: 1. operation of this device in excess of any of these limits may cause permanent damage. 2. thermal resistance measured using infrared measurement technique. 3. this is limited by maximum vdd and ids. derate 12.3 mw/c for tc >112c. product consistency distribution charts [1, 2] figure 1. ids, lsl=42ma , nominal=51ma, usl=66ma figure 2. gain, lsl=8.5db, nominal=9.6db, usl=10.5db figure 5. nf, nominal=1.65db, usl=2.1db figure 3. oip3, lsl=35dbm, nominal=38.4dbm figure 4. p1db, lsl=22dbm, nominal=23.8dbm 1.4 1.6 1.7 1.5 1.8 1.9 2 2.1 usl 50 60 usl lsl 35 36 38 37 39 lsl 22 22.5 23 23.5 24 24.5 lsl usl lsl 8.5 9 9.5 10 10.5 notes: 1. distribution data sample size is 3000 samples taken from 3 diferent wafer lots. future wafers allocated to this product may have nominal values anywhere between the upper and lower limits. 2. measurements were made on a characterization test board, which represents a trade-of between optimal oip3, gain and p1db. circuit trace losses have not been de-embedded from measurements above.
3 electrical specifcations [1] t a = 25c, vdd = 5v symbol parameter and test condition frequency units min. typ. max. ids quiescent current n/a ma 42 51 66 gain gain 3.5 ghz 5 ghz db 8.5 12 9.6 10.5 oip3 [2] output third order intercept point 3.5 ghz 5 ghz dbm 35 36.8 38.4 C nf noise figure 3.5 ghz 5 ghz db C 2 1.65 2.1 s11 input return loss, 50 ? source 3.5 ghz 5 ghz db -18 -16 s22 output return loss, 50 ? load 3.5 ghz 5 ghz db -16 -15 s12 reverse isolation 3.5 ghz 5 ghz db -21 -18 op1db output power at 1db gain compression 3.5 ghz 5 ghz dbm 22 22 23.8 C notes: 1. measurements obtained using demo board described in figure 22 and 23. both 3.5ghz and 5ghz data were taken with 3ghz - 6ghz application test circuits. 2. oip3 test condition: f rf1 - f rf2 = 10mhz with input power of -10dbm per tone measured at worse side band. 3. use proper bias, heat sink and de-rating to ensure maximum channel temperature is not exceeded. see absolute maximum ratings and application note (if applicable) for more details.
4 typical performance (2ghz - 4ghz) t a = 25c, vdd = 5v, input signal = cw. application test circuit is shown in figure 22 and table 1. figure 6. ids over temperature figure 7. gain over frequency and temperature figure 8. oip3 over frequency and temperature figure 9. p1db over frequency and temperature figure 10. s11 over frequency and temperature figure 11. s22 over frequency and temperature 30 40 50 60 70 80 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 temperature (c) ids (ma) 26 28 30 32 34 36 38 40 42 44 46 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 frequency (ghz) oip3 (dbm) -40 -35 -30 -25 -20 -15 -10 -5 0 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 frequency (ghz) s11 (db) 6 7 8 9 10 11 12 13 14 15 16 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 frequency (ghz) gain (db) 17 18 19 20 21 22 23 24 25 26 27 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 frequency (ghz) p1db(dbm) -40 -35 -30 -25 -20 -15 -10 -5 0 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 frequency (ghz) s22 (db) 85c 25c -40c 85c 25c -40c 85c 25c -40c 85c 25c -40c 85c 25c -40c
5 figure 12. s12 over frequency and temperature figure 13. noise figure over frequency and temperature typical performance (3ghz - 6ghz) t a = 25c, vdd = 5v, input signal = cw. application test circuit is shown in figure 22 and table 2. figure 14. ids over temperature figure 15. gain over frequency and temperature figure 16. oip3 over frequency and temperature figure 17. p1db over frequency and temperature typical performance (2ghz - 4ghz) t a = 25c, vdd = 5v, input signal = cw. application test circuit is shown in figure 22 and table 1. 85c 25c -40c -30 -28 -26 -24 -22 -20 -18 -16 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 frequency (ghz) s12 (db) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 frequency (ghz) nf(db) 85c 25c -40c 30 40 50 60 70 80 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 temperature (c) ids (ma) 26 28 30 32 34 36 38 40 42 44 46 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6 5.8 6.0 frequency (ghz) oip3 (dbm) 6 7 8 9 10 11 12 13 14 15 16 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6 5.8 6.0 frequency (ghz) gain (db) 17 18 19 20 21 22 23 24 25 26 27 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6 5.8 6.0 frequency (ghz) p1db(dbm) 85c 25c -40c 85c 25c -40c 85c 25c -40c
6 figure 18. s11 over frequency and temperature figure 19. s22 over frequency and temperature figure 20. s12 over frequency and temperature figure 21. noise figure over frequency and temperature typical performance (3ghz - 6ghz) t a = 25c, vdd = 5v, input signal = cw. application test circuit is shown in figure 22 and table 2. 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6 5.8 6.0 frequency (ghz) nf(db) 85c 25c -40c -25 -23 -21 -19 -17 -15 -13 -11 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6 5.8 6.0 frequency (ghz) s12 (db) -30 -25 -20 -15 -10 -5 0 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6 5.8 6.0 frequency (ghz) s11 (db) -30 -25 -20 -15 -10 -5 0 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6 5.8 6.0 frequency (ghz) s22 (db) 85c 25c -40c 85c 25c -40c 85c 25c -40c
7 application schematic components table and demo board figure 22. application schematic figure 23. demo board layout C recommended pcb material is 10 mils rogers ro4350, with fr4 backing for mechanical strength. C suggested component values may vary according to layout and pcb material. c14 c13 rfout l1 vdd vdd c1 c3 c2 top view c7 c13 c14 c8 rfin 3 1 2 rfin gnd rfout
8 demo board part list table 1. 2ghz - 4ghz application schematic components circuit symbol size value part number description l1 0603 8.2nh llq1608-f8n2 (toko) wire wound chip inductor c1 0402 100pf grm1555c1h101jz01 (murata) ceramic chip capacitor c2 0402 0.1uf grm155r71c104ka88d (murata) ceramic chip capacitor c3 0805 2.2uf grm21br61e225ka12l (murata) ceramic chip capacitor c7 0402 1nh ll1005-fhl1n0 (toko) mlc inductor c8 0402 1nh ll1005-fhl1n0 (toko) mlc inductor c13 0402 39pf cm05ch390j50ah (kyocera) ceramic chip capacitor c14 0402 39pf cm05ch390j50ah (kyocera) ceramic chip capacitor table 2. 3ghz - 6ghz application schematic components circuit symbol size value part number description l1 0603 8.2nh llq1608-f8n2 (toko) wire wound chip inductor c1 0402 100pf grm1555c1h101jz01 (murata) ceramic chip capacitor c2 0402 0.1uf grm155r71c104ka88d (murata) ceramic chip capacitor c3 0805 2.2uf grm21br61e225ka12l (murata) ceramic chip capacitor c7 0402 39pf cm05ch390j50ah (kyocera) ceramic chip capacitor c8 0402 39pf cm05ch390j50ah (kyocera) ceramic chip capacitor c13 na c14 na test circuit for s-parameter and noise parameter figure 24. s-parameter and noise parameter test circuit 3 1 2 rfin gnd vdd rfout top view port1 port2 / bias tee
9 typical s-parameter (vdd = 5v, t a = 25c, 50 ohm) freq (ghz) s11 (db) s11 (ang) s21 (db) s21 (ang) s12 (db) s12 (ang) s22 (db) s22 (ang) 0.1 -0.83 171.33 -49.08 107.91 -70.09 11.18 -11.42 156.15 0.5 -0.85 133.94 -29.47 73.45 -72.22 8.53 -9.79 54.38 1 -1.73 69.70 -7.88 124.85 -51.74 42.20 -7.59 -28.70 1.5 -18.64 13.90 14.19 -16.36 -28.40 -110.19 -13.30 -84.47 2 -16.77 21.81 15.26 -118.45 -24.68 162.38 -16.46 -119.30 2.2 -17.69 26.98 15.08 -146.17 -23.80 140.85 -20.71 -136.97 2.4 -17.47 27.84 14.78 -169.72 -23.09 123.10 -27.25 -147.15 2.6 -17.54 21.54 14.41 169.77 -22.45 107.84 -36.62 -119.61 2.8 -18.71 9.75 14.06 151.46 -21.86 94.47 -33.44 -73.79 3 -21.50 -7.64 13.71 134.78 -21.30 82.34 -29.50 -90.05 3.2 -26.62 -45.95 13.35 119.28 -20.77 71.05 -26.66 -116.49 3.4 -25.94 -124.50 12.98 104.86 -20.30 60.36 -23.92 -140.25 3.6 -20.44 -160.65 12.60 91.24 -19.87 50.23 -21.74 -159.02 3.8 -16.93 -177.59 12.21 78.46 -19.49 40.73 -20.32 -173.92 4 -14.77 170.22 11.82 66.38 -19.14 31.67 -19.31 175.19 4.2 -13.39 160.76 11.45 54.96 -18.81 23.05 -19.03 166.34 4.4 -12.66 151.96 11.09 43.99 -18.49 14.81 -19.23 160.06 4.6 -12.37 142.32 10.78 33.45 -18.16 6.72 -19.80 154.58 4.8 -12.28 131.95 10.50 23.16 -17.82 -1.24 -20.57 150.45 5 -12.32 119.49 10.23 12.97 -17.50 -9.24 -21.46 145.29 5.2 -11.90 102.53 9.97 2.27 -17.18 -17.80 -24.67 123.26 5.4 -11.51 86.82 9.69 -7.74 -16.90 -25.83 -23.37 106.21 5.6 -10.94 70.38 9.40 -17.72 -16.65 -33.97 -21.51 91.68 5.8 -10.14 53.71 9.10 -27.77 -16.45 -42.22 -19.44 79.92 6 -9.13 38.09 8.75 -37.67 -16.30 -50.47 -17.49 69.67 6.2 -8.04 24.75 8.37 -47.47 -16.21 -58.70 -15.67 59.26 6.4 -6.95 13.52 7.95 -57.15 -16.17 -66.81 -13.97 48.91 6.6 -5.97 4.20 7.50 -66.64 -16.19 -74.66 -12.52 38.89 6.8 -5.14 -2.97 7.00 -75.60 -16.24 -82.14 -11.26 28.93 7 -4.46 -8.67 6.51 -83.99 -16.31 -89.21 -10.27 19.35 8 -2.90 -25.68 4.58 -121.23 -16.31 -120.23 -7.84 -28.28 9 -2.46 -52.31 2.99 -158.46 -16.20 -152.20 -6.19 -69.12 10 -1.73 -90.52 0.67 164.95 -16.99 175.54 -4.64 -97.97 11 -0.89 -118.15 -2.55 136.43 -18.81 150.58 -3.14 -118.40 12 -0.61 -129.25 -5.00 117.68 -19.97 134.70 -2.55 -131.60 13 -0.76 -143.32 -6.00 96.90 -19.81 116.35 -2.38 -146.90 14 -1.01 -166.19 -6.20 70.58 -18.85 92.19 -2.68 -168.13 15 -0.88 168.37 -7.47 41.66 -19.03 65.52 -2.36 162.57 16 -0.85 157.29 -8.58 25.78 -18.91 51.09 -2.07 153.40 17 -1.18 147.97 -8.14 9.21 -17.33 35.32 -2.29 140.45 18 -1.83 133.03 -7.18 -10.20 -15.36 16.25 -2.52 133.73 19 -3.05 112.54 -5.32 -38.11 -12.58 -11.48 -4.28 116.79 20 -4.26 92.05 -4.57 -70.41 -10.96 -43.88 -5.03 93.24
10 part number ordering information part number no. of devices container MGA-30989-BLKG 100 antistatic bag mga-30989-tr1g 3000 13 tape/reel typical noise parameters (vdd = 5v, t a = 25c, 50 ohm) freq (ghz) f min (db) opt mag opt ang r n /z 0 2.0 2.95 0.086 49 0.52 2.5 2.32 0.12 90 0.29 3.0 1.83 0.15 122 0.19 3.5 1.54 0.18 174 0.18 4.0 1.53 0.22 -145 0.17 4.5 1.61 0.24 -103 0.21 5.0 1.78 0.27 -62 0.22 5.5 2.05 0.30 -35 0.32 6.0 2.22 0.33 -7.8 0.37
11 sot89 package dimensions dimensions in mm dimensions in inches symbols minimum nominal maximum minimum nominal maximum a 1.40 1.50 1.60 0.055 0.059 0.063 l 0.89 1.04 1.20 0.0350 0.041 0.047 b 0.36 0.42 0.48 0.014 0.016 0.018 b1 0.41 0.47 0.53 0.016 0.018 0.030 c 0.38 0.40 0.43 0.014 0.015 0.017 d 4.40 4.50 4.60 0.173 0.177 0.181 d1 1.40 1.60 1.75 0.055 0.062 0.069 d2 1.45 1.65 1.80 0.055 0.062 0.069 e 3.94 - 4.25 0.155 - 0.167 e1 2.40 2.50 2.60 0.094 0.098 0.102 e1 2.90 3.00 3.10 0.114 0.118 0.122 s 0.65 0.75 0.85 0.026 0.030 0.034 e 1.40 1.50 1.60 0.054 0.059 0.063 matte finish polish polish d d1 e1 e l b e e1 s c b1 b a or d2 d1 1.24 1.23 0.77 b1 0.2 half etching 1.625 2.35 depth 0.100 e d d1 e1 e l e e1 s or
12 device orientation tape dimensions dimensions in mm notes: 1. 10 sprocket hole pitch cumulative tolerance 0.2 2. camber in compliance with eia 481 3. pocket position relative to sprocket hole measured as true position of pocket, not pocket hole 12.0 .3 ao = 4.60 bo = 4.90 ko = 1.90 5.50 .05 see note 3 1.75 .10 8.00 ? 1.5 +0.1/-0.0 2.00 .05 see note 3 4.00 see note 1 section a - a ? 1.50 min. ao ko r 0.3 typ. r 0.3 max. 0.30 .05 a a bo user feed direction cover tape carrier tape reel 9gx 9gx 9gx 9gx
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2013 avago technologies. all rights reserved. av02-2251en - may 23, 2013 reel dimensions C 13 reel ? 20.2 m i n 2.0 0.5 ? 13.0 +0.5 -0.2 102.0 ref 330.0 ref 8.4 (measured at hub) (measured at hub) "a" attention electrostatic sensitive devices safe handling required minneapolis usa u.s pat 4726534 r lokreel r 11.1 max. detail "a" detail "b" ps 6 6 p s 1.5 88 ref 96.5 +0.3 - 0.2 dimensions in mm


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